To reserve time on a resource, or to view more information about a resource, click on the resource name.
| Dicing/Bonding
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Bonder, Wedge
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| Dicing/Bonding
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Dicing Saws- ADT
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| Dicing/Bonding
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Dicing Saws- Microautomation
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| Dicing/Bonding
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Gold Ball Bonder
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| Dicing/Bonding
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Lapper/Polisher
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| Film Deposition
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E-beam Evaporator, Tellmark
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| Film Deposition
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E-beam Evaporator, Varian 3 Pocket
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| Film Deposition
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PECVD, STS 310PC SiO2 - SiN - Amorphous Si
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| Film Deposition
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Sputter Deposition, Cook Vaccum Systems
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| Film Deposition
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Sputter Deposition, KJL CMS-18 Multi-Source
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| Hot Processing
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Furnace Tube, Tystar #1 Wet and dry Ox
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| Hot Processing
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Furnace Tube, Tystar #2 dry Ox and Annealing
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| Hot Processing
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Furnace Tube, Tystar #3 LPDCV Nitride
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| Hot Processing
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Furnace Tube, Tystar #4 Poly sil and doping
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| Hot Processing
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RTA, Steag 100CS RTP
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| Hot Processing
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Wafer Bonder, EVG 501
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| Metrology
|
5 PT Probe Station
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| Metrology
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Electronic Measurement, Lakeshore 7507 Hall Effect
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| Metrology
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Ellipsometer, J.A. Woolam
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| Metrology
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Photospectrometer, Filmetrics F40
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| Metrology
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Photospectrometer, Nanometrics Nanospec
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| Metrology
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Profilometer, Dektak 150
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| Metrology
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Profilometer, Dektak II A #1
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| Metrology
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Profilometer, Dektak II A #2
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| Metrology
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Profilometer, Tencor Alpha-Step-200
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| Photolithography
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E-beam Evaporator, PVD
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| Photolithography
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E-Beam Lithography, Raith 150
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| Photolithography
|
Hotplate, CEE
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| Photolithography
|
Mask Aligner, EVG Model 620 w/BSA
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| Photolithography
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Mask Aligner, Karl Suss MA6
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| Photolithography
|
Mask Aligner, Karl Suss MJB3
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| Photolithography
|
Oven, Despatch, Inert Atmosphere
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| Photolithography
|
Oven, YES, Image Reversal/HMDS
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| Photolithography
|
Spin Coater, Headway, E-Beam Bay
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| Photolithography
|
Spin Coater, Headway, Litho Bay
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| Photolithography
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Spin Coater, Laurell, E-Beam Bay
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| Photolithography
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Spin Coater, Laurell, Litho Bay
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| Plasma
|
Asher, Anatech Barrel SCE600
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| Plasma
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Deep RIE, STS
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| Plasma
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RIE/ICP, Unaxis SLR
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| Unknown
|
Staff Time
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| Wet Processing
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Acids and HF Bench
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| Wet Processing
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RCA Bench
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